Dry etching strategy of spin-transfer-torque magnetic random access memory: A review

R Islam, B Cui, GX Miao - Journal of Vacuum Science & Technology B, 2020 - pubs.aip.org
The spin-based memory, spin transfer torque-magnetic random access memory (STT-
MRAM), has the potential to enhance the power efficiency of high density memory systems …

[图书][B] FinFET devices for VLSI circuits and systems

SK Saha - 2020 - taylorfrancis.com
To surmount the continuous scaling challenges of MOSFET devices, FinFETs have emerged
as the real alternative for use as the next generation device for IC fabrication technology …

[HTML][HTML] Electron dynamics during the reignition of pulsed capacitively-coupled radio-frequency discharges

K Hernandez, LJ Overzet, MJ Goeckner - Journal of Vacuum Science & …, 2020 - pubs.aip.org
The authors report on phase resolved optical emission spectroscopy (PROES)
measurements of pulsed capacitive coupled plasmas (CCPs) through argon. The PROES …

Comparison of radio-frequency power architectures for plasma generation

A Al Bastami, H Zhang, A Jurkov… - 2020 IEEE 21st …, 2020 - ieeexplore.ieee.org
Applications such as plasma generation require the generation and delivery of radio-
frequency (rf) power into widely-varying loads while simultaneously demanding high …

Experimental and PIC MCC study of electron cooling—re-heating and plasma density decay in low pressure rf ccp argon afterglow

OV Proshina, TV Rakhimova, AS Kovalev… - Plasma Sources …, 2020 - iopscience.iop.org
In this work, experimental and theoretical study of pulsed discharge in argon has been
carried out. The experimental data on the dynamics of electron density, electron …

[HTML][HTML] Three-dimensional measurements of fundamental plasma parameters in pulsed ICP operation

J Han, P Pribyl, W Gekelman, A Paterson - Physics of Plasmas, 2020 - pubs.aip.org
Radio frequency inductively coupled plasma sources are widely used in low temperature
industrial processing. Recent computer simulations and experiments indicate significant …

Etch characteristics of Si and TiO2 nanostructures using pulse biased inductively coupled plasmas

SG Kim, KC Yang, YJ Shin, KN Kim, DW Kim… - …, 2020 - iopscience.iop.org
The etch characteristics of Si and TiO 2 nanostructures for optical devices were investigated
using pulse biased inductively coupled plasmas (ICP) with SF 6/C 4 F 8/Ar and BCl 3/Ar …

Transients using low-high pulsed power in inductively coupled plasmas

C Qu, SK Nam, MJ Kushner - Plasma Sources Science and …, 2020 - iopscience.iop.org
Pulsed inductively coupled plasmas (ICPs) are widely deployed in the fabrication of
semiconductor devices. Pulse repetition frequencies of up to tens of kHz are commonly used …

Silicon nitride spacer etching selectively to silicon using CH3F/O2/He/SiCl4 plasma

N Possémé, M Garcia-Barros, C Arvet… - Journal of Vacuum …, 2020 - pubs.aip.org
Using CH 3 F/O 2/He based chemistries in high density plasmas for silicon nitride spacer
etching, loss of silicon in active source/drain regions of CMOS transistors can be observed …

[图书][B] Electrical measurements of capacitively coupled pulsed power plasmas

AF Press - 2020 - search.proquest.com
Pulsing the power to radio frequency (rf) driven plasmas creates transition periods which
exhibit plasma conditions not reachable in continuous wave plasmas. One advantageous …