Optimization of epoxy molding compound to enhance the solder joints robustness during thermal cycling for a clip bond power package
Z Li, H Chen, H Fan, J Yang - 2020 21st International …, 2020 - ieeexplore.ieee.org
Clip bonding technology is widely and increasingly used in microelectronic packages
because of the increasing demand for high power and low loss automotive grade power …
because of the increasing demand for high power and low loss automotive grade power …