A critical review on performance, reliability, and fabrication challenges in nanosheet FET for future analog/digital IC applications

S Valasa, S Tayal, LR Thoutam, J Ajayan… - Micro and …, 2022 - Elsevier
This article critically reviews the fabrication challenges, emerging materials (wafer, high-k
oxide, gate metal, channel materials), dimensional influences, thermal effects, growth …

Review of nanosheet metrology opportunities for technology readiness

MA Breton, D Schmidt, A Greene… - Journal of Micro …, 2022 - spiedigitallibrary.org
Over the past several years, stacked nanosheet gate-all-around (GAA) transistors captured
the focus of the semiconductor industry and have been identified as the lead architecture to …

Variability analysis of the epitaxial layer TFET due to gate work function variation, random dopant fluctuation, and oxide thickness fluctuation using the statistical …

RG Debnath, S Baishya - Semiconductor Science and …, 2022 - iopscience.iop.org
In this paper, a comparative study on process variability considering work function variation
(WFV), random dopant fluctuation (RDF), and oxide thickness fluctuation (OTF) in epitaxial …

Exploring XOR-based Full Adders and decoupling cells to variability mitigation at FinFET technology

FGRG da Silva, RNM Oliveira, AL Zimpeck… - Integration, 2022 - Elsevier
This work analyzes a set of Full Adder circuits considering variability effects, comparing
delay and energy consumption when operating at nominal voltage and near-threshold …

A Unified Model of Drain Current Local Variability due to Channel Length Fluctuation for an n-channel Eδ DC MOS Transistor

S Sengupta, S Pandit - Silicon, 2022 - Springer
A drain current local variability compact model due to random fluctuation of channel length
induced by line edge roughness/line width roughness (LER/LWR) is derived here. The …