Detection and mitigation of position spoofing attacks on cooperative uav swarm formations

S Bi, K Li, S Hu, W Ni, C Wang… - IEEE Transactions on …, 2023 - ieeexplore.ieee.org
Detecting spoofing attacks on the positions of unmanned aerial vehicles (UAVs) within a
swarm is challenging. Traditional methods relying solely on individually reported positions …

Online failure analysis and autonomous risk control scheme for electric buses

HA Taha, S Yacout, Y Shaban - Engineering Failure Analysis, 2023 - Elsevier
This paper proposes a Cyber–Physical System (CPS) scheme to address the challenge of
developing self-improvement and online risk control for Electric Buses (E-Bus) in the …

A Rotating Machinery Fault Diagnosis Method Based on Multi-Sensor Fusion and ECA-CNN

H Wang, H Zhu, H Li - IEEE Access, 2023 - ieeexplore.ieee.org
Fault diagnosis is critical to maintaining the performance of rotating machinery and ensuring
the safe operation of the equipment. Convolutional neural networks (CNNs) have recently …

Reliability analysis of reusable turbine rotor blisk: An application of parametric modelling method under multi-field coupling

W Wang, Y Ma, B Liu, G Cai, P Jin - Engineering Failure Analysis, 2023 - Elsevier
As a critical component of reusable rocket engines (RRE), the cyclic life of the turbine rotor
blisk often varies due to uncertainties such as machining errors and other factors. However …

Restoration of the hippocampal CA1 area activity by close-loop adaptive stimulation

M Mishchenko, M Matveeva, A Fedulina… - 2023 7th Scientific …, 2023 - ieeexplore.ieee.org
The main idea of the project is to integrate an artificial neural network, implemented as an
electronic circuit, with microcircuits of the living brain. Depending on the set of input signals …

Efficient mixed-type wafer defect pattern recognition using a novel joint attention skipped graph convolutional neural network

G Natesan, Z Ahmed, P Singhal - Multidisciplinary Science Journal, 2023 - malque.pub
For wafer foundries to maintain high yield and quality, errors in manufacturing wafers must
be identified and corrected. To find the source of problems and increase overall yield, defect …