Recent progress on polyphenylene oxide-based thermoset systems for high-performance copper-clad laminates
With the rapid development of electronic information technology in the 5G era towards high
integration, short propagation delay, and elevated assembly temperatures, more academic …
integration, short propagation delay, and elevated assembly temperatures, more academic …
Thermal, mechanical and dielectric property enhancement of benzoxazine-containing phthalonitrile resin: The effect of functional oligomeric polyphenyl ether
Two oligomeric polyphenyl ethers (PPE) with different functional groups (hydroxyl group and
allyl group) were introduced into the benzoxazine-containing phthalonitrile resin, in order to …
allyl group) were introduced into the benzoxazine-containing phthalonitrile resin, in order to …
Ultra‐low loss polyphenylene oxide‐based composites with negative thermal expansion fillers
X Zhu, Z Fang, Y Yi, Z Wang, Y Meng, Q Liu… - Polymer …, 2023 - Wiley Online Library
The mismatch of coefficient of thermal expansion (CTE) of components has created
numerous reliability issues in electronic packages. Incorporating inorganic fillers into …
numerous reliability issues in electronic packages. Incorporating inorganic fillers into …