Epoxy resins are widely utilized in electronics, electrical components, and communication
equipment for polymer‐based wave‐transparent composites. However, the dielectric …

An eye diagram, a critical metric in signal integrity analysis for high-speed interconnects
such as packages, interposer, and printed circuit boards (PCBs), is generated by …

In this article, a policy-based reinforcement learning (RL) method for optimizing through
silicon via (TSV) array design in high-bandwidth memory (HBM) considering signal integrity …

In this work, we propose a deep reinforcement learning (DRL) framework called Pin-opt,
designed to create a reusable solver capable of optimizing pin assignment to minimize …

An electromagnetic (EM)-circuit cosimulation approach is presented for evaluating the
vulnerability of integrated circuits (ICs) when exposed to external EM waves. The approach …

当带宽达到20 GHz 以上时(波长从15 mm 到无穷小), 高速高密度电子系统的内部电路电磁环境
变得十分复杂, 越来越难以建模和分析预测, 进一步当带宽达到40 GHz 以上时 …

Electromagnetic Compatibility (EMC) refers to the ability of an electronic device or system to
function properly in an electromagnetic environment without causing adverse …

This article proposes a new vertical conductive structure (VeCS) to replace the general via
structure for signal connection on printed circuit boards (PCBs). Vias have been widely used …

The paper presents a quasi-static simulation of symmetric multiconductor transmission lines
(MCTL) with asymmetrical terminations: reflection symmetric meander lines and MCTL with …

The paper presents the results of simulation devices used to protect equipment in differential
and common modes against pulse interference. We investigate how conductor arrangement …