Enhanced flame retardant and dielectric properties of oligo (2, 6-dimethyl-1, 4-phenylene ether) resins through DOPO derivative incorporation
YC Chen, JB Yang, SKR Kamani, MW Wang, JM Jehng… - Polymer, 2024 - Elsevier
Owing to their low-dissipation factor, oligo (2, 6-dimethyl-1, 4-phenylene ether)(OPE) resins
are commonly used to prepare copper-clad laminates (CCL) for high-frequency …
are commonly used to prepare copper-clad laminates (CCL) for high-frequency …
[HTML][HTML] Curing kinetics study of thermosetting resin material with ultra-low dielectric loss for advanced electronic packaging
Z Fang, X Wu, X Zhu, C Luo, D Li, Q Liu, K Wang - Polymer Testing, 2024 - Elsevier
Ultra-low-loss resin materials are widely utilized in the novel electronic packaging. In this
study, we have investigated the curing reaction kinetics of ultra-low-loss thermosetting resin …
study, we have investigated the curing reaction kinetics of ultra-low-loss thermosetting resin …
Application of Multi-Vinyl Silicon-Containing Cross-Linkers in Free-Radical Cross-Linked Thermosets with Ultra-Low Dielectric Loss
Z Fang, X Zhu, Y Yi, Q Liu, K Wang - Industrial & Engineering …, 2024 - ACS Publications
Ultralow-loss thermosetting resins cured via free-radical polymerization have been
extensively applied as the polymeric matrix in high-frequency and high-speed printed circuit …
extensively applied as the polymeric matrix in high-frequency and high-speed printed circuit …
Flame-Retardant GF-PSB/DOPO-POSS Composite with Low Dk/Df and High Thermal Stability for High-Frequency Copper Clad Applications
K Zheng, Y Zhang, J Qiu, G Xie, Z Huang, W Lin, Z Liu… - Polymers, 2024 - mdpi.com
In the field of high-frequency communications devices, there is an urgent need to develop
high-performance copper clad laminates (CCLs) with low dielectric loss (Df) plus good flame …
high-performance copper clad laminates (CCLs) with low dielectric loss (Df) plus good flame …
Monomer ratio‐controlled polyimides with enhanced dielectric properties and thermal stabilities through crosslinking network
YJ Huang, JW Lin, YH Lee… - Journal of Polymer …, 2024 - Wiley Online Library
Polyimides (PI) are considered as one of the most used materials for flexible printed circuit
board substrates because of their excellent thermal stabilities, outstanding mechanical …
board substrates because of their excellent thermal stabilities, outstanding mechanical …