With the rapid development of electronic information technology in the 5G era towards high
integration, short propagation delay, and elevated assembly temperatures, more academic …

Two oligomeric polyphenyl ethers (PPE) with different functional groups (hydroxyl group and
allyl group) were introduced into the benzoxazine-containing phthalonitrile resin, in order to …

The mismatch of coefficient of thermal expansion (CTE) of components has created
numerous reliability issues in electronic packages. Incorporating inorganic fillers into …

Owing to their low-dissipation factor, oligo (2, 6-dimethyl-1, 4-phenylene ether)(OPE) resins
are commonly used to prepare copper-clad laminates (CCL) for high-frequency …

Ultra-low-loss resin materials are widely utilized in the novel electronic packaging. In this
study, we have investigated the curing reaction kinetics of ultra-low-loss thermosetting resin …

With the rapid development of electronic information industry has raised the requirements for
the performance of electronic components. Therefore, it is essential to research dielectric …

Ultralow-loss thermosetting resins cured via free-radical polymerization have been
extensively applied as the polymeric matrix in high-frequency and high-speed printed circuit …

In the field of high-frequency communications devices, there is an urgent need to develop
high-performance copper clad laminates (CCLs) with low dielectric loss (Df) plus good flame …

Polyimides (PI) are considered as one of the most used materials for flexible printed circuit
board substrates because of their excellent thermal stabilities, outstanding mechanical …