This study reviews the existing research on the effects of surface roughness on the
wettability and intermetallic compound (IMC) layer formation in lead-free solder joints. The …

In the realm of military and defence applications, exposure to radiation significantly
challenges the performance and reliability of solder alloys and joints in electronic systems …

Purpose This paper aims to investigate the effect of different doses of gamma radiation on
the micromechanical response (hardness properties and creep behaviour) of 96.5 Sn-3.0 Ag …

The main objective of this study is to investigate the electrical properties of Sn–3.0 Ag–0.5
Cu solder joint with the incorporation of carbon nanotube instead of solder bulk. Sn–3.0 Ag …

Electronic applications are now driving packaging technology that is equivalent to primary
computer packages for the past 25 years. The electronic application currently shows an …

Intermetallic compound (IMC) growth is being analyzed due to its significant effect on solder
joint reliability. It appears that from various works conducted whereby the excessive growth …

Solder joint, crucial component in electronic systems, face significant challenges when
exposed to extreme conditions during applications. The solder joint reliability involving …

Carbon nanotubes (CNTs) are being applied with increasing frequency for advanced
soldering. They have excellent mechanical, electrical, and thermal properties and are …

Ball grid array (BGA) technology is one of the technologies used in surface mount
technology (SMT). It provides many interconnection points via the solder ball and thus give …

In this paper, based on the crystallographic characteristics of η-Cu 6 Sn 5, a 1× 1× 5
supercell was constructed, and Ni atom was doped into each of the eight Cu2 sites …