Nanoelectronics is changing the way the world communicates, and is transforming our daily
lives. Continuing Moore's law and miniaturization of low-power semiconductor chips with …

The advancement in the field of 3D integration circuit technology leads to new challenges for
quality assessment of interconnects such as through silicon vias (TSVs) in terms of …

Interior tomography is a promising technique that can be used to image large objects with
high acquisition efficiency. However, it suffers from truncation artifacts and attenuation value …

In the past few decades, Flip chip (FC) has been one of the mainstream technologies in IC
packaging. But the size and spacing of the solder bumps are decreasing gradually, defect …

Pulsed infrared thermography (PIRT) is a very fast and non-destructive technique for testing
various types of specimens. This makes PIRT interesting for 100%-inspections in industrial …

Reverse Engineering of printed circuit boards (PCBs) has become increasingly critical for
quality assurance purposes. Reverse engineering can be accomplished using non …

In this paper a review of the development of x-ray computed tomography (CT) for non-
destructive failure analysis in microelectronics packages and boards is presented. The …

In this study we demonstrate the capabilities of pulsed infrared thermography (PIRT) for the
inspection of sintered and soldered chip interconnections. Furthermore, this work will …

This research focuses on the application of lock-in thermography (LIT) for inspecting
sintered chip interconnections, which are commonly used in electronic components. By …

Several of the critical drawbacks to existing failure analysis imaging techniques, including
the low resolution of common non-destructive techniques and the destructiveness and slow …