Power module packaging technologies have been experiencing extensive changes as the
novel silicon carbide (SiC) power devices with superior performance become commercially …

Semiconductor power modules are core components of power electronics in electrified
vehicles. Packaging technology often has a critical impact on module performance and …

Silicon-Carbide (SiC) devices with superior performance over traditional silicon power
devices have become the prime candidates for future high-performance power electronics …

Planar, double-side cooled power modules are emerging in electric-drive inverters because
of their low profile, better heat extraction, and lower package parasitic inductances …

A new 3-D power module dedicated to SiC mosfet is presented. It is based on printed circuit
board embedded die technology and is compared with a standard power module. After …

This paper proposes a highly integrated multichip silicon carbide (SiC) MOSFET power
module packaging with optimized electrical and thermal performances. The structure of the …

摘要开关变换器广泛应用于可再生能源并网, 电机驱动系统, 消费电子供电等领域,
其电磁干扰问题日益突出, 因此该问题的解决非常重要. 该文总结开关变换器传导干扰抑制策略 …

Power module packaging technologies are undergoing extensive changes to satisfy
compact high-power-density systems. The advantages of double-sided cooling power …

Low-profile double-side cooled power modules are emerging in electric-drive inverters to
achieve higher power density and efficiency. However, the rigid interconnection between the …

A new three dimensional package based on Printed Circuit Board (PCB) embedded die
technology is presented in this paper. The package takes advantage of the Power Chip On …