This article presents a new modeling and optimization approach for low return-loss transition
of millimeter wave signals in flip-chip die-to-die interconnects using silicon interposer …

This paper presents a four-channel bi-directional core chip in 0.13 um CMOS for X-band
phased array Transmit/Receive (T/R) module. Each channel consists of a 5-bit step …

Organic non-linear optical pure and xylenol orange (XO) doped benzophenone (BP) single
crystals have been grown by a modified Czochralski technique. A low cost CZ system was …

The heterogeneous integration of silicon germanium (SiGe) and gallium arsenide (GaAs)
technologies is presented using a novel encapsulated packaging approach with organic …

This paper presents, for the first time, an integrated microfluidic cooling scheme on
multilayer organic liquid crystal polymer (LCP) substrate for high power X-band gallium …

Gallium nitride (GaN) amplifiers are inherently well suited for high power applications, but
their increased power densities call for high thermal conductivity (k) substrates, such as …

A planar antenna with an integrated receiver based on aperture coupled antenna elements
with inclusive slots elec trically coupled to a microstrip feed network residing above a lower …

This letter presents a Ka-band receiver front end in the form of system in package using
silicon substrate. The front end adopts a dualchannel superheterodyne structure, two GaAs …

Gallium nitride (GaN) technology has emerged as a frontrunner for high power electronics
applications. By performing a survey of wire-bond and flip-chip-packaged GaN HEMTs on …

An antenna assembly includes a composite substrate. One or more first antenna elements
are secured to the composite substrate. A microstrip feed network is secured to the …