The heat generation of electronic devices is increasing dramatically, which causes a serious
bottleneck in the thermal management of electronics, and overheating will result in …

The purpose of this literature review is to compare different cooling technologies currently in
development in research laboratories that are competing to solve the challenge of cooling …

To improve the heat transfer performances of microchannel heat sink (MCHS), the advanced
channel structures and working fluids can be applied. In this paper, the wavy channel …

Active liquid cooling technique with great efficiency not only reduces power consumption but
also effectively dissipates high heat flux. In this study, a manifold-microchannel heat sink …

Temperature non-uniformity on chips has drawn the attention of researchers due to
unwanted thermal stress development on chips resulting in a reduction in their life cycle and …

Manifold microchannel heat sinks (MMCHSs) have attracted attention for the thermal
management of high-performance electronics owing to their high heat dissipation rate and …

In this study, numerical models of an active thermal management system (TMS) using a two-
phase refrigerant and a passive TMS using phase change material (PCM) for lithium ion …

Cooling of electronic components is important as demand for reduced component size and
the increased heat generation rate cause the heat flux to increase. Liquid-cooled heat sinks …

This paper constructs a three-dimensional model to numerically investigate the heat transfer
and fluid flow characteristics of combined microchannel with cone-shaped micro pin fins …

Effective thermal management for light-emitting diodes (LEDs) is critical, as temperature
significantly affects their lifetime and performance. In this study, a system combining a …