As the most common of the intermetallic compounds (IMCs) formed between Sn-based
solders and Cu substrates during the packaging of integrated circuits (ICs), Cu 6 Sn 5 is …

Sn whiskers are thin filaments that grow spontaneously out of the surface of coatings on Cu
and have become a critical reliability problem in Pb-free electronics. In this review, we focus …

The thickness of the solder, for Cu/Sn/Cu microbumps with dimensions of tens of microns or
even a few microns (such as 40 µm, 15 µm, 10 µm, and 6 µm), can have a significant effect …

Constructing a stable and robust solid electrolyte interphase (SEI) is crucial for achieving
dendrite‐free sodium metal anodes and high‐performance sodium batteries. However …

The composition of alloying elements in Sn-rich solder plays a pivotal role in determining the
performance of solder joints in an electronic package. Recently, Indium (In) has attracted …

The mechanical reliability of the future miniaturized interconnects is mainly governed by the
intermetallic compounds such as Cu 6 Sn 5. Alloyed Cu 6 Sn 5 with various elements …

The mechanical behavior of Sn-rich solder/Cu joints is highly sensitive to processing
variables such as solder reflow time, cooling rate, and subsequent thermal aging. In this …

In order to obtain a better understanding of the phase stabilities and mechanical behaviors
of Cu 3 Sn compounds, we performed first-principles calculations to predict the structural …

We report in this paper Young's moduli and hardness of Cu6Sn5, Cu3Sn, and Ni3Sn4
intermetallic compounds (IMCs) measured by nanoindentation. The samples were prepared …

Na metal is regarded as a promising anode for Na batteries owing to its high specific
capacity and natural abundance. However, rapid dendrite growth and low reversibility …