Step phenomenon of intermetallic compounds thickness during laser soldering dependence on laser power

S Zhao, M Gong, L Jiang, L Cen, M Gao - Journal of Manufacturing …, 2023 - Elsevier
The thickness of Cusingle bondSn intermetallic compounds (IMCs) plays a crucial role in
determining the quality of laser soldering joints. However, there is a lack of research on laser …

Investigating the impact of different solder alloy materials during laser soldering process

Z Bachok, A Abas, HF Tang, MZH Nazarudin… - Soldering & Surface …, 2024 - emerald.com
Purpose This study aims to investigate the influence of different solder alloy materials on
passive devices during laser soldering process. Solder alloy material has been found to …

Effect of different beam distances in laser soldering process: a numerical and experimental study

MZH Nazarudin, MA Abas… - Soldering & Surface …, 2024 - emerald.com
Purpose This paper aims to investigate the effect of different beam distance by
understanding laser beam influence on solder joint quality. The utilisation numerical-based …

Numerical investigation of solder joint shape for micro-spring package during vacuum vapor phase soldering

X Li, P Wu - Microelectronics Reliability, 2024 - Elsevier
The novel micro-coil spring package has become a new choice for reliable applications in
extreme temperature change, high-strength impact, long-term vibration and other harsh …

Numerical simulation and experimental study on wetting of Sn-based solder for laser soldering

F Li, Q Wang, J Shu, H Chen, H Li - Journal of Mechanical Science and …, 2024 - Springer
Abstract iSoldering_wetting software was used to simulate the solder wetting process in
laser soldering. Based on the simulation, the range of process parameters was initially …

Laser Rework Process for Efficient Lead-Free Solder Joints Ball Grid Array (BGA) Component Rework

AA Ismail, MA Bakar, A Jalar, ZE Zolkefli… - IEEE Transactions …, 2024 - ieeexplore.ieee.org
Laser rework (LR) and hot air rework (HR) process impact on the nearby ball grid array
(BGA) rework components with lead-free solder Sn3. 0Ag0. 5Cu (SAC305) solder joints …

An Adaptive Sliding-Mode Observer-Based Fuzzy Proportional Integral Control Method for Temperature Control of Laser Soldering Process

H Tan, Z Chen, Y Bao - Journal of Dynamic Systems …, 2025 - asmedigitalcollection.asme.org
In the process of electronic packaging, laser soldering exhibits advantages such as
noncontact, minimal thermal affected zone, and rapid soldering process. Additionally, the …

An Adaptive Sliding-Mode Observer-Based Fuzzy PI Control Method for Temperature Control of Laser Soldering Process

H Tan, Z Chen, Y Bao - Journal of Dynamic Systems …, 2024 - asmedigitalcollection.asme.org
In the process of electronic packaging, laser soldering exhibits advantages such as non-
contact, minimal thermal affected zone, and rapid soldering process. Additionally, the …

Monitoring Of Laser Soldering Process In Hybrid Additive Manufacturing

AP Pustinger - 2024 - scholarworks.utep.edu
Additive manufacturing (AM) has been a maturing technology that has expanded over the
course of the last decade in major advancements especially in accessibility, process …

Monitoring of Laser Soldering Process in Hybrid Additive Manufacturing

PPV ALEXANDER - search.proquest.com
Additive manufacturing (AM) has been a maturing technology that has expanded over the
course of the last decade in major advancements especially in accessibility, process …