A review of recent research on heat transfer in three-dimensional integrated circuits (3-D ICs)
Three-dimensional integrated circuits (3-D IC) technology has emerged in the past few
decades, driven in part by the techno-economic difficulties of dimensional scaling and the …
decades, driven in part by the techno-economic difficulties of dimensional scaling and the …
Monolithic 3D Integrated circuits: Recent trends and future prospects
Monolithic 3D integration technology has emerged as an alternative candidate to
conventional transistor scaling. Unlike conventional processes where multiple metal layers …
conventional transistor scaling. Unlike conventional processes where multiple metal layers …
Forming‐Free Resistive Switching of Electrochemical Titanium Oxide Localized Nanostructures: Anodization, Chemical Composition, Nanoscale Size Effects, and …
R Tominov, V Avilov, Z Vakulov… - Advanced Electronic …, 2022 - Wiley Online Library
Electrochemical anodization is a powerful method for the preparation of oxide thin films with
controlled thickness, structure, and composition and proves as a promising approach to be …
controlled thickness, structure, and composition and proves as a promising approach to be …
Special session–machine learning in test: A survey of analog, digital, memory, and rf integrated circuits
Integrated circuit (IC) testing presents complex problems that, when ICs become large, are
exceptionally difficult to solve by traditional computing techniques. To deal with …
exceptionally difficult to solve by traditional computing techniques. To deal with …
A Survey and Recent Advances: Machine Intelligence in Electronic Testing
Integrated circuit (IC) testing presents complex problems that for large circuits are
exceptionally difficult to solve by traditional computing techniques. To deal with …
exceptionally difficult to solve by traditional computing techniques. To deal with …
Thermal Side-channel Leakage Protection in Monolithic Three Dimensional Integrated Circuits
J Dofe - 2022 IEEE 35th International System-on-Chip …, 2022 - ieeexplore.ieee.org
Monolithic 3D (M3D) ICs are promising 3D technology to overcome conventional
integration's communication bottleneck. It also offers advantages like high-density …
integration's communication bottleneck. It also offers advantages like high-density …
Multi-tier 3D IC physical design with analytical quadratic partitioning algorithm using 2D P&R tool
In this study, we developed a complete flow for the design of monolithic 3D ICs. We have
taken the register-transfer level netlist of a circuit as the input and synthesized it to construct …
taken the register-transfer level netlist of a circuit as the input and synthesized it to construct …
[PDF][PDF] The Editor Journal of Electronic Testing: Theory and Applications
S Roy - 2023 - eng.auburn.edu
Integrated circuit (IC) testing presents complex problems that for large circuits are
exceptionally difficult to solve by traditional computing techniques. To deal with …
exceptionally difficult to solve by traditional computing techniques. To deal with …
Built-In Self Test (BIST) Architecture Simulation for Testing Crosstalk Effects in Array Structured Through Silicon Vias (TSV) in 3DICs
K Praveen Kumar Reddy… - Journal of …, 2023 - ingentaconnect.com
In this research, a BIST (built in self test) architecture for testing crosstalk effects in highly
dense Through Silicon Via (TSV) placed in structured array form, in 3DICs (Three …
dense Through Silicon Via (TSV) placed in structured array form, in 3DICs (Three …