The electronic equipment developing towards miniaturization and high integration is facing
the danger of high heat flux and non-uniform temperature distribution which leads to the …

Recent technological advancements have led to a drastic increase in heat flux dissipation,
which is a prime factor for lower efficiency and permanent failure. Therefore, cooling …

In this study, laminar, steady-state, incompressible flow with conjugate heat transfer was
investigated for one flow passage of a microchannel with staggered diamond-shaped pin fin …

Microchannel heat sink without any tip clearance ie completely closed microchannels have
been focused and widely studied. In the present work, detailed comparative analysis has …

In an effort to reduce the highest temperature of electronic pieces, using high performance
cooling systems is required, and for this reason, optimization is one of the most essential …

Temperature non-uniformity on chips has drawn the attention of researchers due to
unwanted thermal stress development on chips resulting in a reduction in their life cycle and …

To solve the increasingly serious thermal management problem of chips with multi-cores
and high power density in the three-dimensional integrated circuit (3D-IC), a model of 3D-IC …

Heat sinks are considered as heat exchangers employed to cool high-temperature devices
such as electronic components. They can significantly improve heat dissipation from the …

With the miniaturized and high-powered development of power equipment and electronic
devices, the microchannel heat sink is becoming an important device widely used in the …

Concentrated photovoltaic/thermal hybrid systems are a combination of concentrated
photovoltaics and photovoltaic/thermal hybrid systems which capture waste heat for later …