IR and Raman spectroscopic studies show that the catalyst EL10V1 consists of a
'monolayer'of surface vanadyl complexes spread on the TiO 2 support surface. Such a …

Field programmable gate arrays (FPGAs) based time-to-digital converters (TDCs) have been
broadly investigated and widely used in recent years. However, voltage variations on the …

Here is a complete methodology of substrate noise modeling. The aim of this study is to
predict the perturbations induced by digital commutations flowing through the substrate to …

Testing of signal integrity (SI) in current high-speed ICs, requires automatic test equipment
test resources at the multigigahertz range, normally not available. Furthermore, for most …

Predicting substrate cross-talks in mixed-signal circuits has become a critical issue to
preserve signal integrity in future integrated systems. Phenomena that involve substrate …

In 3D integrated circuits, substrate coupling effects due to propagation of high frequency
(HF) parasitic signals are carried by through silicon vias (TSV). These electrical coupling …

The paper is devoted to a test-per-clock method of an at-speed testing of crosstalk faults in
long interconnects between cores in systems-on-a-Chip. A linear feedback shift register …

An interposer test vehicle with TSVs (through-silicon vias) and two redistribute layers (RDLs)
on the top side for 2.5 D integration was fabricated and high-frequency interconnections …

Signal integrity verification is becoming an impor-tant issue as technological process
features continues to shrink and logic speed increases. Advanced technologies permit a …

In this work a digital filter is placed on the same chip as an analog filter. We investigate how
the simultaneous switching noise is propagated from the digital filter to different nodes on a …