The area of micro total analysis systems (μTAS), also called “lab on a chip” or miniaturized
analysis systems, is growing rapidly. This paper represents an update of the earlier reviews …

Thermal-compression bonding (TCB) is the key technology to ensure vertical chip (or wafer)
stacking in three-dimensional (3D) integration with higher I/O density than conventional …

Si-glass bonding is one of the most crucial vacuum packaging methods in semiconductor
devices; however, high temperatures (> 300° C) are required to achieve a high bonding …

The microfluidic lab-on-a-chip allows scientists to conduct chemical and biochemical
analysis in a miniaturized format so small that properties and effects are successfully …

Experiments using laser cooled atoms and ions show real promise for practical applications
in quantum-enhanced metrology, timing, navigation, and sensing as well as exotic roles in …

Originally developed in the late 1960s, anodic bonding, also known as electrostatic bonding,
field-assisted bonding or Mallory bonding, has become one of the most important silicon …

Microfluidics has emerged as a powerful laboratory toolbox for biologists, allowing
manipulation and analysis of processes at a cellular and sub-cellular level, through …

Single-crystal cubic silicon carbide has attracted great attention for MEMS and electronic
devices. However, current leakage at the SiC/Si junction at high temperatures and visible …

Transformation of conventional 2D platforms into unusual 3D configurations provides
exciting opportunities for sensors, electronics, optical devices, and biological systems …

While there have been notable advancements in the quality of epitaxial Ge on Si, the crystal
quality of bulk Ge remains much superior, which provides an effective method to study the …