The recent advances and trends in heterogeneous integrations are presented in this study.
Emphasis is placed on:(A) the definition of heterogeneous integrations,(B) the classifications …

In this investigation, the chip-last, redistribution-layer (RDL)–first, fan-out panel-level
packaging (FOPLP) for heterogeneous integration is studied. Emphasis is placed on the …

Diffusion is one of the most critical and key factor for achieving low temperature and low
pressure thermocompression bonding. In this work, we propose a novel concept of …

Advanced packaging featuring vertical integration has emerged as a crucial technology
facilitating high performance, low power consumption, and compatibility for heterogeneous …

Abstract Electrodeposited< 111>-oriented nanotwinned Cu (NT-Cu) films consist of micron-
scale columnar grains and they are thermally stable up to 400° C. By adding nanoscale …

This paper, for the first time, reports the fabrication of an on-Silicon aperture-coupled 3D
Patch antenna using micromachining and low-temperature, low-pressure Copper (Cu) …

Abstract Three Dimensional IC (3D IC) integration is one of the emerging technology which
suits CMOS applications by stacking various IC layers vertically. In 3D IC, IC Layers are …

Over the period of meticulous scaling IC's are crucially waiting for a platform which is planar.
The most important and actual restriction is nothing, but delay of interconnect is almost …

Abstract 3D Integration technology is probably the best methodologies among others which
suits CMOS applications with in various layers of devices are stacked with high thickness …

Abstract Multichip module (MCM), system-in-package (SiP), and heterogeneous integration
use packaging technology to integrate dissimilar chips, optical devices, and/or packaged …