Ultrasound devices and methods are described, including a repeatable ultrasound
transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable …

(57) ABSTRACT A system for acquiring an ultrasound signal comprises a signal processing
unit adapted for acquiring a received ultra Sound signal from an ultrasound transducer …

To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be
employed in the receive signal path to reduce data bandwidth and a high-speed serial data …

To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be
employed in the receive signal path to reduce data bandwidth and an output data module …

Micromachined ultrasonic transducers integrated with complementary metal oxide
semiconductor (CMOS) substrates are described, as well as methods of fabricating such …

Complementary metal oxide semiconductor (CMOS) ultra sonic transducers (CUTs) and
methods for forming CUTs are described. The CUT's may include monolithically integrated …

CMOS Ultrasonic Transducers and processes for making such devices are described. The
processes may include forming cavities on a first wafer and bonding the first wafer to a …

A modular and tileable sensor array with routing in the interposer carrying the signals from
the sensors to the integrated circuits. In one embodiment a large area modular sensor array …

Aspects of the technology described herein relate to ultra Sound device circuitry as may form
part of a single Substrate ultrasound device having integrated ultrasonic transducers. The …

A universal ultrasound device having an ultrasound includes a semiconductor die; a plurality
of ultrasonic transducers integrated on the semiconductor die, the plurality of ultrasonic …