This paper reviews the physical mechanisms responsible for breakdown current in AlGaN/GaN high electron mobility transistors (HEMTs). Through a critical comparison …
During the last 30 years, significant progress has been made to improve our understanding of gallium nitride and silicon carbide device structures, resulting in experimental …
Communication and information systems are subject to rapid and highly so phisticated changes. Currently semiconductor heterostructure devices, such as Heterojunction Bipolar …
T Kabemura, S Ueda, Y Kawada… - IEEE Transactions on …, 2018 - ieeexplore.ieee.org
We make a 2-D analysis of breakdown characteristics of field-plate AlGaN/GaN HEMTs with a high-k passivation layer, and the results are compared with those having a normal SiN …
H Hanawa, H Onodera, A Nakajima… - IEEE Transactions on …, 2014 - ieeexplore.ieee.org
2-D analysis of breakdown characteristics in AlGaN/GaN high electron mobility transistors (HEMTs) is performed by considering a deep donor and a deep acceptor in a buffer layer …
S Kasap, C Koughia, HE Ruda - Springer handbook of electronic and …, 2017 - Springer
Electrical transport through materials is a large and complex field, and in this chapter we cover only a few aspects that are relevant to practical applications. We start with a review of …
F Gao, SC Tan, JA del Alamo… - … on electron devices, 2013 - ieeexplore.ieee.org
The origin of structural and electrical degradation in AlGaN/GaN high-electron mobility transistors (HEMTs) under OFF-state stress was systematically studied. Hydroxyl groups (OH …
W Saito, T Suwa, T Uchihara, T Naka… - Microelectronics …, 2015 - Elsevier
The breakdown mechanism of high-voltage GaN-HEMT was analysed using the experimental I–V characteristics and two-dimensional device simulation results. The holes …
The review of avalanche multiplication experiments clearly confirms the existence of the impact ionization effect in this class of semiconductors. The semilogarithmic plot of the …