Three-dimensional NoC reliability evaluation

A Eghbal, PM Yaghini, N Bagherzadeh - US Patent 11,093,673, 2021 - Google Patents
Methods, storage mediums, and apparatuses for evaluating the reliability of Three-
Dimensional (3D) Network-on-Chip (NoC) designs are described. The described …

Power-aware Future Computing Systems Using Machine Learning Techniques

F Al-Obaidy - rshare.library.torontomu.ca
There is a growing demand for hardware systems that are computationally efficient and
energy saving, to accelerate compute-intensive applications. These exciting challenges …

Heterogeneous Uncore Architectures in Future Chip-Multi Processors

A Asad - rshare.library.torontomu.ca
Uncore components including on-chip memory systems and interconnects consume a
significant portion of overall energy consumption in emerging embedded applications …