Dislocation density and twinning-related constitutive modeling of substructural evolution in Sn-5Sb-0.5 (Ag/Cu) alloys under monotonic deformation
H Vafaeenezhad, S Aliakbari-Sani, SH Seyedein… - Journal of Alloys and …, 2023 - Elsevier
The development of a numerical model and experimental evaluation of microstructural
evolution during the deformation of such materials are of pronounced significance. In the …
evolution during the deformation of such materials are of pronounced significance. In the …
Microstructure and damage evolution during thermal cycling of Sn-Ag-Cu solders containing antimony
Antimony is attracting interest as an addition to Pb-free solders to improve thermal cycling
performance in harsher conditions. Here, we investigate microstructure evolution and failure …
performance in harsher conditions. Here, we investigate microstructure evolution and failure …
Combination of enhanced strength-ductility trade-off and stress relaxation resistance of MWCNTs reinforced Sn–5Sb-0.3 Cu matrix composite
AA El-Daly, NAM Eid, AA Ibrahiem - Materials Chemistry and Physics, 2023 - Elsevier
In this study, the strength-ductility trade-off and stress relaxation (SR) behavior of Sn–5Sb-
0.3 Cu (SSC503) alloy reinforced with (0, 0.05 and 0.1 wt%) multi-walled carbon nanotubes …
0.3 Cu (SSC503) alloy reinforced with (0, 0.05 and 0.1 wt%) multi-walled carbon nanotubes …
Investigation of the Microstructure, thermal properties, and mechanical properties of Sn-Bi-Ag and Sn-Bi-Ag-Si low temperature lead-free solder alloys
S Chen, X Wang, Z Guo, C Wu, Y Liu, Y Liu, X Su - Coatings, 2023 - mdpi.com
In this study, we investigated the microstructure, mechanical properties, and thermal
performance of Sn-xBi-1Ag (x= 35, 37, 45, and 47 wt.%) solders, with a particular focus on …
performance of Sn-xBi-1Ag (x= 35, 37, 45, and 47 wt.%) solders, with a particular focus on …
Microstructure growth morphologies, macrosegregation, and microhardness in Bi–Sb thermal interface alloys
Due to the rising demand for thermal management technologies within the electronics
industry, there has been an increased emphasis on developing new thermal interface …
industry, there has been an increased emphasis on developing new thermal interface …
Solder Alloy Design: Investigation of Predictive Models for Tensile Properties Based on Different Alloy Compositions and Microstructures
VCE da Silva, G Gouveia, BL Silva, VLD Tomazella… - 2023 - preprints.org
In this study, an extensive data set was based on existing literature records in order to
enable the suitability of several predictive models, from Multiple Linear Regression (MLR) to …
enable the suitability of several predictive models, from Multiple Linear Regression (MLR) to …
[PDF][PDF] Current Trends in Engineering Science (CTES)
SDM Souza, ACB Farias, A de Jesus… - corpuspublishers.com
Alloys containing tin, antimony, copper, and lead are recommended for a variety of
applications due to their excellent friction behavior, reasonably good corrosion resistance …
applications due to their excellent friction behavior, reasonably good corrosion resistance …
Caracterização de ligas Bi-Ni e Bi-Ni-Sn para aplicação como materiais de interface térmica
CB da Cruz - 2020 - repositorio.unicamp.br
O desenvolvimento de materiais de interface térmica (TIMs) eficientes tornou-se uma
demanda emergente, impulsionada principalmente pelo aumento contínuo da dissipação …
demanda emergente, impulsionada principalmente pelo aumento contínuo da dissipação …