Microsystems using three-dimensional integration and TSV technologies: Fundamentals and applications
Z Wang - Microelectronic Engineering, 2019 - Elsevier
As a powerful enabling technology, three-dimensional (3D) integration, which uses wafer
bonding to integrate multiple wafers in the vertical direction and uses through‑silicon-vias …
bonding to integrate multiple wafers in the vertical direction and uses through‑silicon-vias …
Ring PMUT array based miniaturized photoacoustic endoscopy device
The first successful validation of a forward-looking Piezoelectric Micromachined Ultrasound
Transducer (PMUT) ring array designed for photoacoustic endoscopic imaging applications …
Transducer (PMUT) ring array designed for photoacoustic endoscopic imaging applications …
Backward-mode photoacoustic imaging using illumination through a CMUT with improved transparency
X Zhang, X Wu, OJ Adelegan… - IEEE transactions on …, 2017 - ieeexplore.ieee.org
In this paper, we describe a capacitive micromachined ultrasonic transducer (CMUT) with
improved transparency for photoacoustic imaging (PAI) with backside illumination. The …
improved transparency for photoacoustic imaging (PAI) with backside illumination. The …
Fabrication of 2D capacitive micromachined ultrasonic transducer (CMUT) arrays on insulating substrates with through-wafer interconnects using sacrificial release …
OJ Adelegan, ZA Coutant, X Zhang… - Journal of …, 2020 - ieeexplore.ieee.org
A critical component in a three-dimensional (3D) ultrasound imaging system is a two-
dimensional (2D) transducer array. A 2D transducer array is also essential for the …
dimensional (2D) transducer array. A 2D transducer array is also essential for the …
Research on a 3D encapsulation technique for capacitive MEMS sensors based on through silicon via
M Zhang, J Yang, Y He, F Yang, F Yang, G Han, C Si… - Sensors, 2018 - mdpi.com
A novel three-dimensional (3D) hermetic packaging technique suitable for capacitive
microelectromechanical systems (MEMS) sensors is studied. The composite substrate with …
microelectromechanical systems (MEMS) sensors is studied. The composite substrate with …
Fabrication and packaging of CMUT using low temperature co-fired ceramic
This paper presents fabrication and packaging of a capacitive micromachined ultrasonic
transducer (CMUT) using anodically bondable low temperature co-fired ceramic (LTCC) …
transducer (CMUT) using anodically bondable low temperature co-fired ceramic (LTCC) …
Analysis of spring softening effect on the collapse voltage of capacitive MEMS ultrasonic transducers
This paper explained the dependency of collapse voltage on semiconductor device
structural features (membrane diameter, membrane thickness and the vertical distance …
structural features (membrane diameter, membrane thickness and the vertical distance …
Micro-electro-mechanical-system based capacitive ultrasonic transducer as an efficient immersion sensor
In this paper we have analyzed the influence of the membrane inherent residual stress
along with its Young's modulus for evaluating the characteristics of a capacitive …
along with its Young's modulus for evaluating the characteristics of a capacitive …
An FPGA-based backend system for intravascular photoacoustic and ultrasound imaging
X Wu, JL Sanders, X Zhang… - IEEE transactions on …, 2018 - ieeexplore.ieee.org
The integration of intravascular ultrasound (IVUS) and intravascular photoacoustic (IVPA)
imaging produces an imaging modality with high sensitivity and specificity which is …
imaging produces an imaging modality with high sensitivity and specificity which is …
High fill factor piezoelectric micromachined ultrasonic transducers on transparent substrates
This study presents a high fill-factor array of aluminum nitride (AlN) piezoelectric
micromachined ultrasonic transducers (PMUTs) fabricated on a transparent substrate …
micromachined ultrasonic transducers (PMUTs) fabricated on a transparent substrate …