[HTML][HTML] Heterogeneous Bonding of PMMA and Double-Sided Polished Silicon Wafers through H2O Plasma Treatment for Microfluidic Devices

CC Chiang, PN Immanuel, YH Chiu, SJ Huang - Coatings, 2021 - mdpi.com
In this work we report on a rapid, easy-to-operate, lossless, room temperature
heterogeneous H2O plasma treatment process for the bonding of poly (methyl …

Surface activation of poly (methyl methacrylate) for microfluidic device bonding through a H2O plasma treatment linked with a low-temperature annealing

PN Immanuel, CC Chiang, CR Yang… - Journal of …, 2021 - iopscience.iop.org
This paper reports on a rapid, lossless process for the bonding of poly (methyl
methacrylate)(PMMA) substrates for use in microfluidic devices for blood tests, utilizing H 2 …

Heterogeneous bonding between cyclo‐olefin polymer (COP) and glass‐like substrate by newly developed water vapor‐assisted plasma, aqua plasma cleaner

H Terai, R Funahashi, T Hashimoto… - … Engineering in Japan, 2018 - Wiley Online Library
To develop high‐performance and low‐cost microfluidic devices, heterogeneous bonding
with cyclo‐olefin polymer (COP) and glass substrate was investigated by low‐pressure …

Reduction and Surface Treatment for Oxidized Copper Electrodes by Water Vapor Plasma

H Terai, T Hashimoto, H Nakano… - 2019 IEEE CPMT …, 2019 - ieeexplore.ieee.org
Reduction and Surface Treatment for Oxidized Copper Electrodes by Water Vapor Plasma
Page 1 Reduction and Surface Treatment for Oxidized Copper Electrodes by Water Vapor …

水蒸気プラズマによるCOP とガラス系基板の異種材料接合

寺井弘和, 舩橋理佐, 橋本泰知… - 電気学会論文誌E (センサ …, 2018 - jstage.jst.go.jp
抄録 To develop high performance and low cost microfluidic devices, heterogeneous
bonding with cyclo-olefin polymer (COP) and glass substrate was investigated by low …