Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application
YC Huang, YX Lin, CK Hsiung, TH Hung, KN Chen - Nanomaterials, 2023 - mdpi.com
Advanced packaging technology has become more and more important in the
semiconductor industry because of the benefits of higher I/O density compared to …
semiconductor industry because of the benefits of higher I/O density compared to …
Research progress of hybrid bonding technology for three-dimensional integration
A Zhou, Y Zhang, F Ding, Z Lian, R Jin, Y Yang… - Microelectronics …, 2024 - Elsevier
Computing power based artificial intelligence will profoundly change the productivity and
production relations, and the integrated circuit industry begin to rely on three-dimensional …
production relations, and the integrated circuit industry begin to rely on three-dimensional …
Towards standardization of hybrid bonding interface: In-depth study of dielectrics on direct bonding
Hybrid bonding has become the key technology to enabling high density interconnect
interfaces for fine pitch integration through the direct bonding of dielectrics followed by the …
interfaces for fine pitch integration through the direct bonding of dielectrics followed by the …
[PDF][PDF] Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application. Nanomaterials 2023 …
YC Huang, YX Lin, CK Hsiung, TH Hung, KN Chen - 2023 - academia.edu
Advanced packaging technology has become more and more important in the
semiconductor industry because of the benefits of higher I/O density compared to …
semiconductor industry because of the benefits of higher I/O density compared to …
ウェハ接合界面における水分の影響
竹内魁 - エレクトロニクス実装学会誌, 2023 - jstage.jst.go.jp
図 1. 典型的な親水化接合プロセス (a) 表面有機吸着層および自然酸化膜を持つ未処理の Si 基板
(b) プラズマ処理後の水分の物理吸着および化学吸着 (OH 基)(c) 吸着水分の水素結合/分子間力 …
(b) プラズマ処理後の水分の物理吸着および化学吸着 (OH 基)(c) 吸着水分の水素結合/分子間力 …