Numerical Investigation of a Bionic Vapor Chamber Based on Leaf Veins for Cooling Electronic Devices
S Zhu, Z Zhang, H Chen, Y Li - Sustainability, 2023 - mdpi.com
In order to solve the problem of integrated heat dissipation in electronic chips under
continuous high-intensity operation and thus ensure their stable and normal operation, a …
continuous high-intensity operation and thus ensure their stable and normal operation, a …
Separated Liquid–Vapor Flow Analysis in a Mini-Channel with Mesh Walls in the Closed-Loop Two-Phase Wicked Thermosyphon (CLTPWT)
KS Remella, FM Gerner - Energies, 2023 - mdpi.com
A metallic wire mesh screen, wire diameter of approximately 50 μm, is folded into~ 80
“accordion-shaped” mini-channels and placed inside the evaporator package of a novel …
“accordion-shaped” mini-channels and placed inside the evaporator package of a novel …