J Chao-An, H Chia-Wei, C Ren-Jei, S Ying-Hao… - Physics Procedia, 2012 - Elsevier
In this study, seed layer free electrochemical plating deposition (SLF-EPD) for Ag on ALD-
TiN film was demonstrated. By way of the surface condition modification, EPD-Ag film has …