The pursuit of greater performance in microelectronic devices has led to a shrinkage of
bump size and a significant increase in electrical current. This has resulted in a high current …

Pb-free solders have replaced Pb-containing SnPb solders in the electronic packaging
industry due to environmental concerns. Both electromigration (EM) and thermomigration …

Mechanical performance is one of the most important factors influencing the reliability of
solder joints. Heretofore, plenty of works have been conducted on reliability of solder joints …

The morphologies and orientation relationships of Cu6Sn5 grains formed between Sn and
(001),(011),(111) and (123) Cu single crystals under liquid-and solid-state aging conditions …

The application of engineering ceramics is often limited due to its low machining efficiency
and surface/subsurface damage, of which surface/subsurface micro-crack is one of the …

Sn-rich solder joints in three-dimensional integrated circuits and their reliability issues, such
as the electromigration (EM), thermomigration (TM), and thermomechanical fatigue (TMF) …

With the rapid development of electronical products, many primary challenges arise in the
field of design and manufacture, among which the property of electronical packaging …

The characteristics of interfacial intermetallic compounds (IMCs) can have serious impact on
the reliability of solder joints. In this study, Ni nanoparticles (NPs) were added to SAC305 …

Due to the restriction of lead-rich solder and the miniaturization of electronic packaging
devices, lead-free solders have replaced lead-rich solders in the past decades; however, it …

The fracture behavior of microscale lead-free Sn-3.0 Ag-0.5 Cu solder joints of different sizes
was investigated under quasistatic microtension loading. The experimental results show that …