Challenges and opportunities in advanced Ge pMOSFETs

E Simoen, J Mitard, G Hellings, G Eneman… - Materials Science in …, 2012 - Elsevier
This paper aims at reviewing the state-of-the art of Ge pMOSFETs for future high-
performance CMOS devices. Key in the development is the integration of a Ge channel on a …

[HTML][HTML] Berberine protects against 6-OHDA-induced neurotoxicity in PC12 cells and zebrafish through hormetic mechanisms involving PI3K/AKT/Bcl-2 and Nrf2/HO-1 …

C Zhang, C Li, S Chen, Z Li, X Jia, K Wang, J Bao… - Redox biology, 2017 - Elsevier
Berberine (BBR) is a renowned natural compound that exhibits potent neuroprotective
activities. However, the cellular and molecular mechanisms are still unclear. Hormesis is an …

[HTML][HTML] Reducing specific contact resistivity for n-type germanium using laser activation process and nano-island formation

S Baik, H Jeong, G Park, H Kang, JE Jang… - Applied Surface …, 2023 - Elsevier
This study presents a laser activation process (LAP) for germanium (Ge) to improve the
electrical performance of n-type Ge devices. The LAP highly activated the dopant and …

Ge CMOS gate stack and contact development for vertically stacked lateral nanowire FETs

MJH Van Dal, G Vellianitis, G Doornbos… - 2018 IEEE …, 2018 - ieeexplore.ieee.org
We present (i) a novel, thermally stable Atomic Layer Deposition (ALD) high-k dielectric
stack that, for the first time, has the potential to meet all gate stack requirements for both n …

A simplified method for (circular) transmission line model simulation and ultralow contact resistivity extraction

H Yu, M Schaekers, T Schram… - IEEE Electron …, 2014 - ieeexplore.ieee.org
The metal resistance in the transmission line model (TLM) structures creates a serious
obstacle to determine precisely the intrinsic contact resistivity. To tackle this problem, we …

Recrystallization and interdiffusion processes in laser-annealed strain-relaxed metastable Ge0. 89Sn0. 11

S Abdi, S Assali, MRM Atalla, S Koelling… - Journal of Applied …, 2022 - pubs.aip.org
The prospect of GeSn semiconductors for silicon-integrated infrared optoelectronics brings
new challenges related to the metastability of this class of materials. As a matter of fact …

Ge n-channel FinFET with optimized gate stack and contacts

MJH Van Dal, B Duriez, G Vellianitis… - 2014 IEEE …, 2014 - ieeexplore.ieee.org
Whilst high performance p-channel Ge MOSFETs have been demonstrated [1–4], Ge n-
channel MOSFET drive current has been lagging behind mainly hampered by high access …

Ohmic Contact Formation on N-Type Using Selenium or Sulfur Implant and Segregation

Y Tong, G Han, B Liu, Y Yang, L Wang… - IEEE transactions on …, 2013 - ieeexplore.ieee.org
The physics of ohmic contact formation for nickel stanogermanide [Ni (Ge 1-x Sn x)] on n-
type germanium-tin (n-Ge 1-x Sn x) was investigated. Low-resistivity Ni (Ge 1-x Sn x) was …

Germanium n-channel planar FET and FinFET: Gate-stack and contact optimization

MJH van Dal, B Duriez, G Vellianitis… - … on Electron Devices, 2015 - ieeexplore.ieee.org
We demonstrate Ge enhancement-mode nMOS FinFETs fabricated on 300-mm Si wafers,
incorporating an optimized gate-stack (interface trap density D it below 2× 10 11 eV-1· cm …

Atomically flat low-resistive germanide contacts formed by laser thermal anneal

M Shayesteh, K Huet, I Toqué-Tresonne… - IEEE transactions on …, 2013 - ieeexplore.ieee.org
In this paper, state-of-the-art laser thermal annealing is used to form germanide contacts on
n-doped Ge and is systematically compared with results generated by conventional rapid …