Lead-free soldering has emerged as one of the key technologies for assembling in
environmental-conscious electronics. Among several candidate alloys, the Sn–Ag–Cu alloy …

Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used
extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi …

A new scheme to predict the intermetallic compound which forms first at the substrate/solder
interface during the soldering process has been suggested. A local equilibrium was …

Rechargeable magnesium batteries have huge potential for applications in large scale
energy storage systems due to their low cost and abundant sources. Nevertheless, not much …

Sn-rich solder joints in three-dimensional integrated circuits and their reliability issues, such
as the electromigration (EM), thermomigration (TM), and thermomechanical fatigue (TMF) …

Abstract Replacing Pb-Sn with Pb-free solders is one of the most important issues in the
electronic industry. Melting, dissolution, solidification and interfacial reactions are …

Sn-Bi alloys emerged as promising candidates for low temperature solder materials due to
their low cost and low liquidus temperature. However, the Sn-Bi solders tend to have low …

The phase equilibria of the Cu-In-Sn system were investigated by means of the diffusion
couple method, differential scanning calorimetry (DSC) and metallography. The isothermal …

A thermodynamic assessment of the Bi–Sn–Zn ternary system was carried out using the
CALPHAD approach along with thermodynamic descriptions from new assessments of the …

The Bi–In–Sn–Zn system is an important alloy system in lead-free soldering.
Thermodynamic descriptions for the ternary systems Bi–In–Sn, Bi–In–Zn, Bi–Sn–Zn and In …