A review of fingerprint sensors: Mechanism, characteristics, and applications

Y Yu, Q Niu, X Li, J Xue, W Liu, D Lin - Micromachines, 2023 - mdpi.com
Identification technology based on biometrics is a branch of research that employs the
unique individual traits of humans to authenticate identity, which is the most secure method …

Emerging materials for microelectromechanical systems at elevated temperatures

JA Krogstad, C Keimel, KJ Hemker - Journal of Materials Research, 2014 - cambridge.org
Extension of microelectromechanical systems (MEMS) into more extreme operating
conditions will require a wider range of material properties than are currently available in …

In Planta Nitrate Sensor Using a Photosensitive Epoxy Bioresin

H Ibrahim, S Yin, S Moru, Y Zhu… - … Applied Materials & …, 2022 - ACS Publications
Nitrogen management through monitoring of crop nitrate status can improve agricultural
productivity, profitability, and environmental performance. Current plant nitrate test methods …

Fast analytical design of MEMS capacitive pressure sensors with sealed cavities

V Rochus, B Wang, HAC Tilmans, AR Chaudhuri… - Mechatronics, 2016 - Elsevier
This paper presents a fast design strategy for MEMS capacitive pressure sensors with
sealed cavities. Based on circular Kirchhoff-Love plate theory and the perfect gas law, the …

Vibrational and mechanical properties of Si/Ge nanowires as resonators: A molecular dynamics study

D Georgakaki, OG Ziogos… - physica status solidi …, 2014 - Wiley Online Library
In this work, we examine the vibrational and mechanical properties of clamped‐clamped
rectangular SixGe1− x and Si/SixGe1− x nanowires (NWs) using molecular dynamics …

[HTML][HTML] Design and Implementation of a CMOS-MEMS Out-of-Plane Detection Gyroscope

H Tian, Z Zhang, L Liu, W Wei, H Cao - Micromachines, 2024 - mdpi.com
A MEMS gyroscope is a critical sensor in attitude control platforms and inertial navigation
systems, which has the advantages of small size, light weight, low energy consumption, high …

Integration of GMR-based spin torque oscillators and CMOS circuitry

T Chen, A Eklund, S Sani, S Rodriguez, BG Malm… - Solid-State …, 2015 - Elsevier
This paper demonstrates the integration of giant magnetoresistance (GMR) spin torque
oscillators (STO) with dedicated high frequency CMOS circuits. The wire-bonding-based …

Fabrication and noise reduction of the miniature tactile sensor using through-silicon-via connection with signal amplifier

H Yokoyama, M Sohgawa, T Kanashima… - Japanese Journal of …, 2013 - iopscience.iop.org
A miniature tactile sensor has been fabricated by connecting stress-sensitive part with an
amplifier of integrated circuit through through-silicon-via (TSV) electrically. The sensitive part …

Anisotropic vapor HF etching of silicon dioxide for Si microstructure release

V Passi, U Sodervall, B Nilsson, G Petersson… - Microelectronic …, 2012 - Elsevier
Damages are created in a sacrificial layer of silicon-dioxide by ion implantation to enhance
the etch rate of silicon-dioxide in liquid and vapor phase hydrofluoric acid. The etch rate ratio …

Heterogeneous integration technology

B Bayraktaroglu - AFRL/RYDD, Wright Patterson AFB, 2017 - apps.dtic.mil
This report provides a review of the heterogeneous integration of different types of devices
and materials for the purpose of increasing the functional density and therefore the …