This perspective provides an overview of early developments, current status, and remaining challenges of microLED (lLED) technology, which was first reported in Applied Physics …
C Bower, M Meitl, D Gomez, S Bonafede… - US Patent …, 2016 - Google Patents
In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for …
C Prevatte, C Bower, RS Cok, M Meitl - US Patent 10,468,363, 2019 - Google Patents
A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive …
CA Bower, RS Cok, M Meitl, CR Prevatte - US Patent 10,103,069, 2018 - Google Patents
(57) ABSTRACT A printed electrical connection structure includes a substrate having one or more electrical connection pads and a micro transfer printed component having one or more …
RS Cok - US Patent 10,468,391, 2019 - Google Patents
Primary Examiner Ahmed N Sefer (74) Attorney, Agent, or Firm William R. Haulbrook; Michael D. Schmitt; Choate, Hall & Stewart LLP (57) ABSTRACT An inorganic light-emitting …
RS Cok - US Patent 11,061,276, 2021 - Google Patents
A micro-LED laser display having an array of display pixels includes a display substrate for displaying an image and an array of display pixels. Each display pixel has one or more …
RS Cok - US Patent 11,064,609, 2021 - Google Patents
(57) ABSTRACT A printable electronic component includes a component substrate and a circuit disposed in or on the component substrate. One or more electrically conductive …