Skin care for healthy silicon solar cells

A Cuevas, T Allen, J Bullock, Y Wan… - 2015 IEEE 42nd …, 2015 - ieeexplore.ieee.org
Effective surface treatments suppress possible recombination losses and confine
photogenerated electrons and holes within the bulk of the silicon wafer, thus maximizing …

Multi-physics coupling aid uniformity improvement in pattern plating

L Ji, C Wang, S Wang, K Zhu, W He, D Xiao - Circuit World, 2016 - emerald.com
Purpose The uniformity of electrodeposition is the key to successful application of pattern
plating because the quality of electrodeposited copper layer has a huge impact on the …

高速电镀铜技术在先进封装金属互连中的研究进展.

陈平, 夏良, 贺京峰, 刘冰 - Micronanoelectronic Technology, 2024 - search.ebscohost.com
简单阐述了高速电镀铜技术在先进封装金属互连结构中的应用, 重点介绍了电镀液,
电镀设备和工艺控制三个因素对电镀速率和质量的影响, 并对国内外电镀液添加剂种类 …

High speed Cu plating technology for wafer level packaging

J Wang, D Wang, Z Jia - 2021 22nd International Conference …, 2021 - ieeexplore.ieee.org
According to Moore's Law, the wafer level packaging and fan-out packaging market is
expected to witness a compound annual growth rate (CAGR) of 18% during the forecasted …

Making multi-component structures using dynamic menisci

M Balucani - US Patent 11,795,562, 2023 - Google Patents
A solution for making multi-component structures (145) is proposed. A corresponding
method comprises delivering a plurality of galvanic solutions (115) at least in part different …

[PDF][PDF] A new metallization technology for solar cells application

K Kholostov - 2015 - core.ac.uk
This Ph. D. thesis is focused on the development and optimization of front and rear side
metallization of industrial silicon solar cells. The commonly adopted screenprinted silver …