Recently, much research has been performed involving the mechanical analysis of
biological and polymeric samples with the use of Atomic Force Microscopy (AFM). Such …

The field of piezoresistive sensors has been undergoing a significant revolution in terms of
design methodology, material technology and micromachining process. However, the …

The coefficient of hygroscopic swelling (CHS) of self-organized and shear-oriented cellulose
nanocrystal (CNC) films was determined by capturing hygroscopic strains produced as …

Moisture induced failure is one of the major reliability concerns in electronic packaging. This
research provides a comprehensive solution for modeling the moisture induced …

The normalization approach has been accepted as a routine to overcome the concentration
discontinuity at multi-material interfaces in the moisture diffusion simulation by the finite …

Time–temperature superposition is a well-established principle used in the constitutive
description of viscoelastic polymers. To expand the description to moisture-induced …

In this study, the drift of microelectromechanical system (MEMS) accelerometers stored at
room temperature for one year is investigated by both finite-element analysis (FEA) …

In 2009, Xie et al. proposed a diffusion simulation method called direct concentration
approach (DCA), which aimed at solving moisture diffusion problems in electronic packages …

This paper examines the comprehensive effects of vapor pressure, hygroscopic swelling
and thermal expansion on the reliability of stacked die package during soldering reflow by …

Polymer-based materials are commonly used as an adhesion layer for bonding die chip and
substrate in micro-system packaging. Their properties exhibit significant impact on the …