This paper first reviews manufacturing technologies for realizing air-filled metal-pipe
rectangular waveguides (MPRWGs) and 3-D printing for microwave and millimeter-wave …

In the last couple of decades, solid-state device technologies, particularly electronic
semiconductor devices, have been greatly advanced and investigated for possible adoption …

This letter reports for the first time on a very low loss silicon micromachined waveguide
technology, implemented for the frequency band of 220-325 GHz. The waveguide is realized …

A D-band waveguide diplexer, implemented by silicon micromachining using releasable
filling structure (RFS) technique to obtain high-precision geometries, is presented here for …

For terahertz systems, rectangular waveguide is an ideal low loss medium for
interconnectivity and the construction of passive circuits. A drawback when manufacturing …

This paper presents techniques used to assemble and measure micromachined
submillimeter-wave waveguide circuits operating from 500 to 750 GHz. A novel …

A miniaturized substrate integrated waveguide bandpass filter with an area of 0.682× 0.210
mm 2 is proposed based on through-silicon via (TSV) technology for terahertz (THz) …

Micromachined packaging is emerging as the best choice for development of terahertz
multipixel heterodyne array instruments and other advanced terahertz systems. Traditional …

This paper presents two WR-3 band (220-325 GHz) filters, one fabricated in metal using
high precision computer numerically controlled milling and the other made with metallized …

A new integration concept for terahertz (THz) systems is presented in this article, wherein
patterned silicon-oninsulator wafers form all DC, IF, and RF networks in a homogeneous …