A review of global modeling of charge transport in semiconductors and full-wave electromagnetics

RO Grondin, SM El-Ghazaly… - IEEE transactions on …, 1999 - ieeexplore.ieee.org
Models of semiconductor devices that combine complex transport models with full-wave
solutions of Maxwell's equations are reviewed. Both hydrodynamic and ensemble Monte …

Extending the two-dimensional FDTD method to hybrid electromagnetic systems with active and passive lumped elements

W Sui, DA Christensen… - IEEE Transactions on …, 1992 - ieeexplore.ieee.org
The finite-difference-time-domain (FDTD) method is extended to include distributed
electromagnetic systems with lumped elements (a hybrid system) and voltage and current …

Transient simulation of lossy interconnects based on the recursive convolution formulation

S Lin, ES Kuh - IEEE Transactions on Circuits and Systems I …, 1992 - ieeexplore.ieee.org
An approach for transient simulation of lossy interconnects terminated in arbitrary nonlinear
elements based on convolution simulation is presented. The Pade approximations of each …

Progress in the methodologies for the electrical modeling of interconnects and electronic packages

AE Ruehli, AC Cangellaris - Proceedings of the IEEE, 2001 - ieeexplore.ieee.org
The rapid growth of the electrical modeling and analysis of the interconnect structure, both at
the electronic chip and package level, can be attributed to the increasing importance of the …

A fast algorithm and practical considerations for passive macromodeling of measured/simulated data

D Saraswat, R Achar, MS Nakhla - IEEE Transactions on …, 2004 - ieeexplore.ieee.org
Passive macromodeling of high-speed package and interconnect modules characterized by
measured/simulated data has generated immense interest during the recent years. This …

Causal-convolution-a new method for the transient analysis of linear systems at microwave frequencies

TJ Brazil - IEEE transactions on microwave theory and …, 1995 - ieeexplore.ieee.org
A new convolution-type method is presented for the transient analysis of causal linear
systems described in the frequency-domain. The central novelty lies in the proposed method …

Accurate frequency-domain modeling and efficient circuit simulation of high-speed packaging interconnects

WT Beyene, J Schutt-Aine - IEEE Transactions on Microwave …, 1997 - ieeexplore.ieee.org
The paper describes an efficient frequency-domain modeling and simulation method of a
coupled interconnect system using scattering parameters. First, low-order rational …

A new on-chip interconnect crosstalk model and experimental verification for CMOS VLSI circuit design

Y Eo, WR Eisenstadt, JY Jeong… - IEEE transactions on …, 2000 - ieeexplore.ieee.org
A new, simple closed-form crosstalk model is proposed. The model is based on a lumped
configuration but effectively includes the distributed properties of interconnect capacitance …

Transient simulation of arbitrary nonuniform interconnection structures characterized by scattering parameters

T Dhaene, L Martens, D De Zutter - IEEE Transactions on …, 1992 - ieeexplore.ieee.org
A noniterative time-dependent circuit model is presented for transient analysis of general
uniform and nonuniform interconnection structures terminated with arbitrary, linear or …

Time-domain macromodels for VLSI interconnect analysis

SY Kim, N Gopal, LT Pillage - IEEE Transactions on Computer …, 1994 - ieeexplore.ieee.org
This paper presents a method of obtaining time-domain macromodels of VLSI
interconnection networks for circuit simulation. The goal of this work is to include …