State of the art and future perspectives in advanced CMOS technology

HH Radamson, H Zhu, Z Wu, X He, H Lin, J Liu… - Nanomaterials, 2020 - mdpi.com
The international technology roadmap of semiconductors (ITRS) is approaching the
historical end point and we observe that the semiconductor industry is driving …

Miniaturization of CMOS

HH Radamson, X He, Q Zhang, J Liu, H Cui, J Xiang… - Micromachines, 2019 - mdpi.com
When the international technology roadmap of semiconductors (ITRS) started almost five
decades ago, the metal oxide effect transistor (MOSFET) as units in integrated circuits (IC) …

Spatial mapping of band bending in semiconductor devices using in situ quantum sensors

DA Broadway, N Dontschuk, A Tsai, SE Lillie… - Nature …, 2018 - nature.com
Local variations in the charge distribution at semiconductor interfaces can lead to energy
level band bending in the structure's band diagram. Measuring this band bending is …

Modeling of gate stack patterning for advanced technology nodes: A review

X Klemenschits, S Selberherr, L Filipovic - Micromachines, 2018 - mdpi.com
Semiconductor device dimensions have been decreasing steadily over the past several
decades, generating the need to overcome fundamental limitations of both the materials …

Effect of annealing temperature on microstructure and resistivity of TiC thin films

L Aihaiti, K Tuokedaerhan, B Sadeh, M Zhang, X Shen… - Coatings, 2021 - mdpi.com
Titanium carbide (TiC) thin films were prepared by non-reactive simultaneous double
magnetron sputtering. After deposition, all samples were annealed at different temperatures …

Investigation of N type metal TiAlC by thermal atomic layer deposition using TiCl4 and TEA as precursors

J Xiang, Y Ding, L Du, C Xu, T Li, X Wang… - ECS Journal of Solid …, 2016 - iopscience.iop.org
N type metal gate TiAlC film was grown by thermal atomic layer deposition (ALD) technique
using titanium tetrachloride (TiCl 4) and triethylaluminum (TEA) as precursors for the first …

[图书][B] Ultra-high temperature materials III

IL Shabalin - 2020 - Springer
This book is the third volume in my Ultra-High Temperature Materials (UHTM) series, which
is devoted to the materials having melting (sublimation or decomposition) points around or …

Growth mechanism of atomic-layer-deposited TiAlC metal gate based on TiCl4 and TMA precursors

J Xiang, Y Ding, L Du, J Li, W Wang, C Zhao - Chinese Physics B, 2016 - iopscience.iop.org
TiAlC metal gate for the metal-oxide-semiconductor field-effect-transistor (MOSFET) is grown
by the atomic layer deposition method using TiCl 4 and Al (CH 3) 3 (TMA) as precursors. It is …

The effects of process temperature on the work function modulation of ALD HfO2 MOS device with plasma enhanced ALD TiN metal gate using TDMAT precursor

YJ Kim, D Lim, HH Han, AS Sergeevich… - Microelectronic …, 2017 - Elsevier
We have investigated the effects of metal gate process temperature on the effective work
function (W eff) of MOS devices with all ALD HfO 2/TiN gate stack and its correlation with …

Understanding the role of TiN barrier layer on electrical performance of MOS device with ALD-TiN/ALD-TiAlC metal gate stacks

J Xiang, T Li, X Wang, K Han, J Li… - ECS Journal of Solid …, 2016 - iopscience.iop.org
The role of TiN barrier layer on electrical performance of metal oxide semiconductor (MOS)
with Si/SiO 2/HfO 2/ALD-TiN/ALD-TiAlC structure is investigated. It is found that the effective …