A review on numerical approach of reflow soldering process for copper pillar technology
This paper reviewed the state-of-art copper pillar technology in flip-chip packaging, driven
by the semiconductor industry's demands for thinner and faster data transmission. This …
by the semiconductor industry's demands for thinner and faster data transmission. This …
[HTML][HTML] Optimizing adhesive rheology for stencil printing of fuel cell sealings using supervised machine learning
FI Indicatti, M Rädler, E Stammen, K Dilger - International Journal of …, 2024 - Elsevier
In a single low-temperature proton exchange membrane fuel cell (LT-PEMFC) stack, the
sealings are responsible for preventing leakages, providing electrical insulation and …
sealings are responsible for preventing leakages, providing electrical insulation and …
Three-dimensional CFD simulation of the stencil printing performance of solder paste
The first step in the surface mount technology is the printing of the solder paste. The amount
of solder placed on the cooper pad is important in guaranteeing an acceptable quality of …
of solder placed on the cooper pad is important in guaranteeing an acceptable quality of …
Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction
This paper aims to develop a thermal fluid–structure interaction (FSI) methodology to study
the effect of different Cu pillar bump diameters on thermal and mechanical performance …
the effect of different Cu pillar bump diameters on thermal and mechanical performance …
Multiphase flow in solder paste stencil printing process using CFD approach
Abstract In this paper, Computational Fluid Dynamic (CFD) simulation approach is used to
study the flowability of lead-free solder SAC387 in stencil printing process. The Volume of …
study the flowability of lead-free solder SAC387 in stencil printing process. The Volume of …
SAC105 Stencil printing process using cross viscosity model
The current study shows the used of rheological measurement to get lead-free solder paste
SAC105 type 3 viscosity data to be used in numericalmeasurement. A parallel-plate …
SAC105 type 3 viscosity data to be used in numericalmeasurement. A parallel-plate …
Simulation of temperature profiles in reflow ovens for soldering area array components
A Yuile, S Wiese - 2019 22nd European Microelectronics and …, 2019 - ieeexplore.ieee.org
This paper presents computational fluid dynamics (CFD) simulations in the field of
electronics manufacturing technology of area array components, namely a BGA, where the …
electronics manufacturing technology of area array components, namely a BGA, where the …
Transient numerical modelling of the pin-in-paste technology
Featured Application Enhancing design rules of complex printed circuit boards—electronic
assembly process optimization in the early design phase. Abstract The pin-in-paste …
assembly process optimization in the early design phase. Abstract The pin-in-paste …
Non-Newtonian numerical modelling of solder paste viscosity measurement
TI Al-Ma'aiteh, O Krammer - Soldering & Surface Mount Technology, 2019 - emerald.com
Purpose The purpose of this paper is to present the establishment of a computational fluid
dynamics model for investigating different non-Newtonian rheological models of solder …
dynamics model for investigating different non-Newtonian rheological models of solder …
Simulating the printed circuit board assembly process for image generation
The inspection of printed circuit board assemblies gradually incorporates deep-learning-
based classifiers. However, such classifiers require a vast dataset. To our knowledge, such …
based classifiers. However, such classifiers require a vast dataset. To our knowledge, such …