Packaging reliability effect of ENIG and ENEPIG surface finishes in board level thermal test under long-term aging and cycling
This study illustrates test results and comparative literature data on the influence of
isothermal aging and thermal cycling associated with Sn-1.0 Ag-0.5 Cu (SAC105) and Sn …
isothermal aging and thermal cycling associated with Sn-1.0 Ag-0.5 Cu (SAC105) and Sn …
Reliability analysis of lead-free solders in electronic packaging using a novel surrogate model and kriging concept
H Azizsoltani, A Haldar - Journal of …, 2018 - asmedigitalcollection.asme.org
A novel reliability evaluation procedure of lead-free solders used in electronic packaging
(EP) subjected to thermomechanical loading is proposed. A solder ball is represented by …
(EP) subjected to thermomechanical loading is proposed. A solder ball is represented by …
Accelerated Life-Cycle Testing of Various Lead-Free Solder Alloys by Mechanical Shock and Thermal Cycling Techniques
S Sridhar - 2017 - search.proquest.com
For the last couple of decades, our inclination towards computer technology has increased
broadly. Personal device assistants also known as PDA's have become a part of our daily …
broadly. Personal device assistants also known as PDA's have become a part of our daily …
Reliability of Aging in Microstructures for Sn-Ag-Cu Solder Joints with Different Surface Finishes during Thermal Cycling
C Shen - 2016 - search.proquest.com
A direct and deleterious effect on packaging reliability has been observed during elevated
temperature isothermal aging for fine-pitch ball grid array (BGA) packages with Sn-1.0 Ag …
temperature isothermal aging for fine-pitch ball grid array (BGA) packages with Sn-1.0 Ag …
Reliability Study and Failure Analysis for Surface Finishes on Sn–Ag–Cu Solder Joints During Thermal Cycling
The drive for SAC solders in the microelectronics industry presents several new reliability
challenges. Several surface finishes are tested, compare and find the selection of the proper …
challenges. Several surface finishes are tested, compare and find the selection of the proper …
Fourier Spectral Phase Field Simulations of Elastically Anisotropic Heterogeneous Polycrystals
JB Allen - Journal of Engineering Materials and …, 2018 - asmedigitalcollection.asme.org
In this study, we developed a multi-order, phase field model to compute the stress
distributions in anisotropically elastic, inhomogeneous polycrystals and study stress-driven …
distributions in anisotropically elastic, inhomogeneous polycrystals and study stress-driven …