Isothermal aging causes detrimental changes in the microstructure, mechanical response,
and failure behavior of lead free solder joints in electronic assemblies. These material …

In this investigation, Scanning Electron Microscopy (SEM) and Scanning Probe Microscopy
(SPM) have been utilized to examine aging induced microstructural changes occurring …

Reliable lead free solders are needed for products exposed to extreme environments such
as those used in the automotive, avionics, and oil-exploration industries, as well as in …

One of the most common method of failure in electronic packaging is the fatigue failure of
solder joints. The constituent materials forming the electronic assembly have different …

In this investigation, the effects of isothermal mechanical cycling on damage accumulation in
lead free SAC305 and SAC_Q (SAC+ Bi) solder joints have been explored. In particular, we …

Lead free solder materials are susceptible to significant creep deformations in harsh high
temperature environments including automotive, avionics, military, and oil exploration …

In this work, we have examined the ability of microalloy additions (dopants) to reduce aging
effects in solder joints by nanoindentation testing of several sets of doped/non-doped alloys …

Solder joints in electronic assemblies are often subjected to cyclic (positive/negative)
mechanical strains and stresses. Such exposures can occur in variable temperature …

In this work, we have used nanoindentation methods to explore the creep behavior, and
aging effects of SAC305 solder joints at several elevated testing temperatures from 25 to …

Due to growing environmental concerns, lead-free solder materials are being widely used in
electronic assemblies. The Anand viscoplastic constitutive model is frequently used to …