Zinc (Zn)‐metal anodes are promising candidates for large‐scale, highly safe energy‐
storage systems. However, their cycling life is associated with instability issues such as …

Microvias with various diameters formed by laser ablation on a printed circuit board (PCB)
were used to investigate the filling mechanism of the microvia in copper electroplating. The …

The interactions among additives employed in acidic copper plating solution for microvia
filling are characterized by galvanostatic measurement (GM) and electron paramagnetic …

Copper deposition in a plating bath known to fill narrow trenches was studied on a rotating
disc electrode by impedance measurements. The chemistry of this bath contained, in …

Copper electrodeposition in submicron trenches involves phenomena that span many
orders of magnitude in time and length scales. In the present work, two codes that simulate …

This paper gives a bibliographical review of the finite element methods applied to the
analysis and simulation of coatings, their mechanical and material properties from the …

This study explores how the dissolution of damascene Cu depends on accelerators of
organic acids in alcohol-containing electropolishing electrolytes. Four two-additive …

A model and simulator that describe the dependence of deposition rate and bump formation
on pattern density during electrochemical deposition (ECD) are presented. A curvature …

Primary responses to be considered during process optimization for copper electroplating of
integrated circuits interconnects include filling performance, within die uniformity, within …

When copper is grown by the bottom up growth mecha nism, the phenomena that the grown
copper film rises over trenches and hole patterns due to the higher growth rate in the …