In traditional approach of silicon optical lens production, grinding, lapping, and polishing are
employed. Success of these steps depends on the quality of the preceding ones; therefore …

Surface integrity of parts can seriously be damaged by mechanical and thermal loads during
machining leading to crack initiation, constraining of parts or damage. At present, it is very …

The deformation behavior and phase transformation of 4H silicon carbide (4H-SiC) during
nanoindentation process is investigated with a cube corner diamond indenter through …

In order to suffice the stringent surface requirements imposed on silicon wafers, thorough
investigation of the fabrication methods is necessary. Typically, the processing conditions for …

Silicon has such versatile characteristics that the mechanical behavior and deformation
mechanism under contact load are still unclear and hence are interesting and challenging …

The ductile-to-brittle cutting mode transition in single grit diamond scribing of
monocrystalline silicon is investigated in this paper. Specifically, the effects of scriber tip …

In-situ high temperature nanoscratching of Si (110) wafer under reduced oxygen condition
was carried out for the first time using a Berkovich tip with a ramp load at low and high …

The Letter concerns surface nanodeformation of Si crystal using atomistic simulation. Our
results account for both the occurrence and absence of pop-in events during …

Pressure-induced plastic deformation and phase transformations manifested as the
discontinuities displayed in the loading and unloading segments of the load–displacement …

Indentation-induced phase transformation processes were studied by in situ Raman
microspectroscopy of the deformed contact region of silicon on sapphire samples during …