The rapidly developing III-nitrides materials and devices technologies are driving the
advancements in hybrid heterogeneous structures for multi-material and multifunctional …

Flexible and stable interconnections are critical for the next generation of shape-
conformable and wearable electronics. These interconnections should have metal-like …

Thin metallic films supported on highly oriented pyrolytic graphite (HOPG) with low surface
roughness are needed to improve the performance of different industrial applications and …

Fabrication of ultra-thin gold (Au) layers (UTGLs) has been regarded as the key technique to
achieve applications with tunable optical response, flexible sensors and electronic devices …

Ag sinter pastes comprising Ag nano/microparticles in an organic binder exhibit many
advantages for electronic packaging, such as a low sintering temperature (< 300° C), high …

Photochromic molecules, which change their molecular structure under external stimuli, are
promising for increasing the device functionality without consuming additional space …

Metal electrode deposition is universally adopted in the community for optoelectronic device
fabrication, inducing hybridization at electrode interfaces, and allows efficient extraction or …

In this study, we evaluated the applicability of thin Au/Ti double-layered films as both
bonding layers and gettering material for residual gases in micro-electromechanical system …

Micro/nano patterns based on quantum dots (QDs) are of great interest for applications
ranging from electronics to photonics to sensing devices for biomedical purposes. Several …

There has been considerable interest in building switching functions into self-assembled
monolayers with switching actuated by external stimuli such as light, electrical current, heat …