Abstract Eutectic gallium–indium (EGaIn), a liquid metal with a melting point close to or
below room temperature, has attracted extensive attention in recent years due to its …

The cooling or thermal management issues are facing critical challenges with the
continuous miniaturization and rapid increase of heat flux of electronic devices. Significant …

With the high miniaturization and integration of micro-electro-mechanical systems, micro-
satellite, lasers, and high-voltage electrical appliances, the heat transfer of electronic …

This study investigates numerically, with experimental verification, the performance of a
hybrid multilayer microchannel heat sink with jet impingement. The three-dimensional fluid …

In the field of stretchable electronics, eutectic gallium–indium alloys (EGaIn) have become
an ideal conductive material due to their exceptional electrical conductivity and natural …

Recently, studies on the use of MCHS applied to chips to benefit from the high thermal
conductivity of liquid metals have been increasing. This study came up with an optimum …

Advanced heat dissipation technology is crucial for chip operation and performance
utilization. Room temperature liquid metal convection cooling technology has demonstrated …

Due to recent advancements in micro-electro-mechanical systems (MEMS), the
requirements of extracting a huge heat flux from a small surface area is ever-increasing. The …

In order to overcome the shortcoming of high resistance of liquid metal flow, three new types
of microchannel heat sinks, namely top-slotted microchannel, bottom-extension …

Recently, the thermal management of power electronic converters has gained significant
attention due to the continuous trend of developing very compact power electronic …