The microstructure control and refinement in length scale are pursued in the development of
next generations of Pb-free solder alloys with high reliability in harsh environments. In the …

In this investigation, Scanning Electron Microscopy (SEM) and Scanning Probe Microscopy
(SPM) have been utilized to examine aging induced microstructural changes occurring …

Development of holmium doped eutectic Sn-Ag lead-free solder for electronic packaging |
Emerald Insight Books and journals Case studies Expert Briefings Open Access Publish with us …

The influence of the orientation on the indentation modulus, the hardness and the creep
properties of high purity β-Sn (wt.%: 99.999) have been examined. Nanoindentation …

Abstract Bi, In and Ti were added to Sn-3.8 Ag-0.7 Cu (SAC387) solder alloy to optimize the
mechanical performance. The alloying effects of Bi, In and Ti on the microstructure, thermal …

One of the most common method of failure in electronic packaging is the fatigue failure of
solder joints. The constituent materials forming the electronic assembly have different …

Due to growing environmental concerns, lead-free solder materials are being widely used in
electronic assemblies. The Anand viscoplastic constitutive model is frequently used to …

In this investigation, the effects of isothermal mechanical cycling on damage accumulation in
lead free SAC305 and SAC_Q (SAC+ Bi) solder joints have been explored. In particular, we …

In this work, we have used nanoindentation methods to explore the creep behavior, and
aging effects of SAC305 solder joints at several elevated testing temperatures from 25 to …

Purpose This paper aims to investigate the effect of different doses of gamma radiation on
the micromechanical response (hardness properties and creep behaviour) of 96.5 Sn-3.0 Ag …