With considering the performance computing growing exponentially, heterogeneous
integration becomes as a solution for combining more logic, memory, and specialty chiplets …

In the application of high-performance three-dimensional integrated circuits (3D IC), due to
the continuous decreasing trend of chip interconnection I/O pitch and bump size and pitch …

This paper, for the first time, reports the fabrication of an on-Silicon aperture-coupled 3D
Patch antenna using micromachining and low-temperature, low-pressure Copper (Cu) …

We report detailed observations for temperature deviation (dT) on stacked dice and
temperature for satellite dice (Ts) on several base materials with different thermal …

Antenna-in-package (AiP) technology is a packaging solution where antennas are
incorporated into an integrated circuit (IC) package with a RF chip [1],[2]. One of the …

A typical stack bonding process of HBM core dies is 1) lamination of nonconductive film
(NCF) over the bumps of core dies, 2) thermal compression bonding (TC bonding) of core …

In this paper optimization process of D2W (Die to Wafer) TCB (Thermal Compression
Bonding) stacking for thinned, warped and large dies are investigated. TCB related …

Thermocompression bonding (TCB) is an advantageous method adapted for system
miniaturization, for instance to assemble microelectronic devices in 3D stacks. Low …

Thermal compression bonding (TCB) involves three technology themes: high-speed and
high-accuracy motion, substrate–die planarity, and stability for long production runs. We will …

We demonstrate a dynamic characteristics evaluation system using a flip chip bonder for
non-conductive film (NCF) and its applications for analysis and design of the processes …