[图书][B] Extreme-temperature and harsh-environment electronics: physics, technology and applications
VK Khanna - 2023 - iopscience.iop.org
Electronic devices and circuits are employed by a range of industries in unfriendly
conditions, such as exposure to extreme temperatures, humidity, or radiation. This second …
conditions, such as exposure to extreme temperatures, humidity, or radiation. This second …
Future perspectives and research trends in advanced chemo-mechanical magneto-rheological finishing for enhanced surface quality
The increasing demand for precision manufacturing and surface finishing has prompted the
development of innovative techniques to achieve superior results. Surface quality is …
development of innovative techniques to achieve superior results. Surface quality is …
Experimental Investigation into Double-disc and Chemically Assisted Magnetorheological Finishing Process
A new hybrid finishing process, namely, double-disc chemical-assisted magnetorheological
finishing (DDCAMRF) process has been developed for the polishing of monocrystalline …
finishing (DDCAMRF) process has been developed for the polishing of monocrystalline …
The preparation of polysilicon films on highly boron doped silicon substrates and their effects on Cu out-diffusion
Q Zhang, Z Zhou, Y Shen, W Rao, S Xiao, X Wu… - RSC …, 2024 - pubs.rsc.org
The behavior of copper (Cu) diffusion at different storage temperatures of heavily boron-
doped silicon substrates is investigated. The surface Cu concentration of the substrate with …
doped silicon substrates is investigated. The surface Cu concentration of the substrate with …
Prediction of Surface Roughness in Hybrid Magnetorheological Finishing of Silicon Using Machine Learning
The machining learning-based predictive model of double disc chemo-magnetorheological
finishing process of silicon was proposed in the present manuscript. Six different methods …
finishing process of silicon was proposed in the present manuscript. Six different methods …
Mechanism Exploration of the Effect of Polyamines on the Polishing Rate of Silicon Chemical Mechanical Polishing: A Study Combining Simulations and Experiments
Z Lin, J Zhu, Q Huang, L Zhu, W Li, W Yu - Nanomaterials, 2024 - mdpi.com
Polyamines have become important chemical components used in several integrated circuit
manufacturing processes, such as etching, chemical mechanical polishing (CMP), and …
manufacturing processes, such as etching, chemical mechanical polishing (CMP), and …
Surface Finish Enhancement of Si (100) with Single Pole Magnetic Abrasive Finishing using Chemical Oxidizers and Alumina Slurry
The study aims to improve the surface finish of monocrystalline silicon wafer Si (100) with
single-pole magnetic abrasive finishing along with slurry of alumina (1200 mesh) and …
single-pole magnetic abrasive finishing along with slurry of alumina (1200 mesh) and …
Study of side burr formation in steady-state nano-polishing of Si-wafer using molecular dynamics simulation
With advancements in the semiconductor industry, it is required to have angstrom level
surface finish on silicon wafers which is achieved by nano-polishing. However, side burr is …
surface finish on silicon wafers which is achieved by nano-polishing. However, side burr is …
Reducing Subsurface Damage with Trizact™ Diamond Tile During a Prime Silicon Wafer Grinding Process
JJ Gagliardi, VD Romero, F Stolzenburg… - Journal of Electronic …, 2023 - Springer
Optimizing key components of Trizact™ Diamond Tile can significantly reduce subsurface
damage (SSD) in a prime silicon wafer lapping (or grinding) process. It is proposed that with …
damage (SSD) in a prime silicon wafer lapping (or grinding) process. It is proposed that with …