Integrated circuit containing DOEs of NCEM-enabled fill cells

S Lam, D Ciplickas, T Brozek, J Cheng… - US Patent …, 2017 - Google Patents
2016-06-15 Assigned to PDF SOLUTIONS, INC. reassignment PDF SOLUTIONS, INC.
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …

Mesh-style NCEM pads, and process for making semiconductor dies, chips, and wafers using in-line measurements from such pads

S Lam, D Ciplickas, T Brozek, J Cheng… - US Patent …, 2017 - Google Patents
2016-06-15 Assigned to PDF SOLUTIONS, INC. reassignment PDF SOLUTIONS, INC.
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …

Integrated circuit including NCEM-enabled, interlayer overlap-configured fill cells, with NCEM pads formed from at least three conductive stripes positioned between …

S Lam, D Ciplickas, T Brozek, J Cheng… - US Patent …, 2018 - Google Patents
2017-10-04 Assigned to PDF SOLUTIONS, INC. reassignment PDF SOLUTIONS, INC.
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …

Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, GATE-short-configured …

S Lam, D Ciplickas, T Brozek, J Cheng… - US Patent …, 2017 - Google Patents
2017-01-02 Assigned to PDF SOLUTIONS, INC. reassignment PDF SOLUTIONS, INC.
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …

Process for making semiconductor dies, chips, and wafers using in-line measurements obtained from DOEs of NCEM-enabled fill cells

S Lam, D Ciplickas, T Brozek, J Cheng… - US Patent …, 2020 - Google Patents
2016-06-15 Assigned to PDF SOLUTIONS, INC. reassignment PDF SOLUTIONS, INC.
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …

Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, GATE-short-configured …

S Lam, D Ciplickas, T Brozek, J Cheng… - US Patent …, 2017 - Google Patents
2017-01-02 Assigned to PDF SOLUTIONS, INC. reassignment PDF SOLUTIONS, INC.
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …

Method for processing a semiconductor wager using non-contact electrical measurements indicative of a resistance through a stitch, where such measurements are …

S Lam, D Ciplickas, T Brozek, J Cheng… - US Patent …, 2019 - Google Patents
2017-12-30 Assigned to PDF SOLUTIONS, INC. reassignment PDF SOLUTIONS, INC.
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …

Integrated circuit containing standard logic cells and ilbrary-compatible, NCEM-enabled fill cells, including at least via-open-configured, gate-short-configured, TS …

S Lam, D Ciplickas, T Brozek, J Cheng… - US Patent …, 2017 - Google Patents
2017-01-02 Assigned to PDF SOLUTIONS, INC. reassignment PDF SOLUTIONS, INC.
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …

IC with test structures and E-beam pads embedded within a contiguous standard cell area

S Lam, D Ciplickas, T Brozek, J Cheng… - US Patent …, 2021 - Google Patents
2019-07-17 Assigned to PDF SOLUTIONS, INC. reassignment PDF SOLUTIONS, INC.
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Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE …

S Lam, D Ciplickas, T Brozek, J Cheng… - US Patent …, 2017 - Google Patents
2017-05-12 Assigned to PDF SOLUTIONS, INC. reassignment PDF SOLUTIONS, INC.
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …